Mechanisms of structural-phase transformations during crystallization of solder melt under conditions of magnetic-dynamic influences for carbide tools

The processes of melt formation were studied by methods optical and electron scanning microscopy. These occur during induction brazing a hard alloy to steel holder contact interaction low-melting (copper-zinc system alloy) refractory (iron-nickel) components the solders. It is shown that effect thermal magnetic-dynamic high-frequency electromagnetic field on composite solder how high-strength joint formed. structure forming disperse hardening mechanism. research process for high-melting solders soldering tool showed in brazed seams occurs through number stages this does not lead microstructures are characteristic alloys based copper-iron-phosphorus, copper-zinc-nickel copper-zinc-iron. Thus, use can reduce temperature 40-50 K increase concentration alloying species change its structure. advantages impact materials, strength weld allow you control thickness weld, important when WC-TiC (TaC) systems. High initial dissolution rates nickel particles copper-zinc solubility copper, zinc quasi-liquid alloy. When cooled, other than surrounding composition They morphologically related grain solder. formed (solder) has material which metal enriched nickel, have role reinforcing element.